The three-day second Bay Area Semiconductor Industry Ecosystem Expo (" 2025 Shenzhen Bay Chip Expo ") came to an end at the Shenzhen Convention and Exhibition Center (Futian) on October 17, 2025. The exhibition, themed "Core Innovation for the Future, Intelligent Innovation Ecosystem", brings together the world's TOP30 semiconductor and integrated circuit enterprises, including AMAT, Lam Research, and KLA from the United States, TEL, DISCO, and Nikon from Japan, and Merck and ZEISS from Germany International giants such as Edwards from the UK, 3M from South Korea, and SEMILAB from Hungary, as well as over 600 leading domestic and international companies including North China Creation, New Kailai Industrial Machinery, Toprun Technologies, Shanghai Microelectronics, China Resources Microelectronics, and Huatian Technology, all shone on the same stage, presenting a panoramic picture of the industrial chain.SWISSDAR, which focuses on the research and development of sealing rings and sealing parts, showcased its core FFKM perfluoroether sealing ring product. With its ability to adapt to extreme working conditions, it deepened industry cooperation and demonstrated the breakthrough strength of domestic sealing technology.
This year's Bay Chip Exhibition breaks the traditional division of exhibition areas, covering key links of the industrial chain with "core fields + characteristic tracks". It features four core exhibition areas including chip design and wafer manufacturing, as well as three characteristic exhibition areas including AI chip ecosystem, Chiplet and advanced packaging ecosystem.SWISSDAR closely follows the demands of "wafer manufacturing", highlighting the FFKM perfluoroether sealing ring series and simultaneously introducing high-performance sealing parts such as PEEK and PI, fully meeting the sealing requirements of semiconductor equipment.
During the exhibition, the organizers organized major industrial project clusters in the Greater Bay Area and purchasing teams from leading enterprises such as Samsung, SK Hynix, BYD, Foxconn, and DJI to conduct one-on-one precise matching with the participating enterprises. SWISSDAR, leveraging the high compatibility of FFKM seals and the advantages of domestic products in terms of cost and delivery efficiency, has reached cooperation consensus with multiple enterprises. In the future, it will deepen cooperation around joint testing of equipment sealing systems and the development of domestic alternative solutions to facilitate the localization of equipment.
Data shows that the scale of Shenzhen's semiconductor industry reached 142.4 billion yuan in the first half of 2025, an increase of 16.9% year-on-year. With the acceleration of domestic production of equipment, the demand for high-end seals is on the rise. In the future, SWISSDAR will focus on optimizing material formulas and innovating clean production, shortening delivery cycles, and providing higher-quality and more efficient sealing solutions to help the semiconductor industry chain reduce costs and increase efficiency, injecting impetus into the high-quality development of the industry.